We develop for our customer innovative DRAM product solutions either with our own staff or through suitable cooperation partners. This includes multiple die solutions, design of substrates and coordination of assembly and test.

We can act as responsible project manager if desired by customer. Our experience stretches from SDR to DDR-4, multiple die, special high and low temperature solutions from -40C to 125C, KGD, on chip error correction, twin cell, MCP and others. In our solutions we use classical wire bond packaging technologies as well as RDL and wafer level chip scale packages (WLCSP) with multiple RDL levels. Our staff handles yield management and test optimization at backend location as well as advanced fail analysis methods if required.

Our focus are high quality industrial, server, aerospace and other demanding applications. We use our innovative application test and analysis technology to achieve quick sample realization and support small series high product quality production without huge invest into tester tooling or fixtures.